59th INTERNATIONAL CONFERENCE ON MICROELECTRONICS, DEVICES AND MATERIALS WITH THE WORKSHOP ON ELECTROMAGNETIC COMPATIBILITY: FROM THEORY TO PRACTICE
October 2nd – 4th, 2024
Rimske Terme, Rimske Toplice, Slovenia
Announcement and Call for Papers
GENERAL INFORMATION
The 59th International Conference on Microelectronics, Devices and Materials with the Workshop on Electromagnetic Compatibility: From Theory to Practice continues the successful tradition of annual international conferences organised by the MIDEM Society, the Society for Microelectronics, Electronic Components and Materials. The conference will be held in Rimske Toplice, Slovenia, from OCTOBER 2nd – 4th, 2024.
Topics of interest include but are not limited to:
- Electromagnetic compatibility (workshop topic)
- Novel monolithic and hybrid circuit processing techniques,
- New device and circuit design,
- Process and device modelling,
- Semiconductor physics,
- Sensors and actuators,
- Electromechanical devices, microsystems and nanosystems,
- Nanoelectronics,
- Optoelectronics,
- Photovoltaics,
- Electronic materials science and technology,
- New electronic materials and applications,
- Materials characterization techniques,
- Reliability and failure analysis,
- Education in microelectronics, devices and materials.
ORGANIZER
MIDEM Society – Society for Microelectronics, Electronic Components and Materials, Slovenia
PARTNERS
UL FE, IJS, IMAPS – Slovenia Chapter, IEEE – Slovenia Section
IMPORTANT DATES
Abstract submission deadline: May 17, 2024
Acceptance notification: June 30, 2024
Full paper submission deadline: August 31, 2024
Invited and accepted papers will be published in the Conference Proceedings.
Detailed and updated information about the MIDEM Conferences, as well as instructions for paper preparation, can be found on: www.midem-drustvo.si/conf2024/